Integrated ceiling device with mechanical arrangement for a light source

ABSTRACT

An integrated ceiling device ( 80, 120 ) includes an electronics assembly ( 56 ) and a mechanical arrangement ( 20 ). The mechanical arrangement includes a housing ( 22 ), a heat dissipating structure ( 24 ), and support arms ( 26 ). The housing is configured to retain the electronics assembly. The heat dissipating structure includes a lamp seat ( 50 ) for receiving a light source ( 54 ), and a central opening ( 34 ) surrounded by fins ( 36 ). The support arms extend between and interconnect the housing with the heat dissipating structure. The housing is positioned within the central opening and is spaced apart from the fins of the heat dissipating structure to enable a free flow of air in an air gap ( 42 ) between the housing ( 22 ) and the structure ( 24 ). The electronics assembly may include a plurality of elements ( 160, 162, 164, 166 ) retained in the housing which are spaced apart from the heat dissipating structure.

CROSS REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of the earlier U.S. Utility patentapplication entitled “INTEGRATED CEILING DEVICE WITH MECHANICALARRANGEMENT FOR A LIGHT SOURCE,” Ser. No. 17/032,650, filed Sep. 25,2020, which is a continuation of the earlier U.S. Utility patentapplication entitled “INTEGRATED CEILING DEVICE WITH MECHANICALARRANGEMENT FOR A LIGHT SOURCE,” Ser. No. 16/883,028, filed May 26,2020, which is a continuation of the earlier U.S. Utility patentapplication entitled “INTEGRATED CEILING DEVICE WITH MECHANICALARRANGEMENT FOR A LIGHT SOURCE,” Ser. No. 15/089,146, filed Apr. 1,2016, which is a continuation of the earlier U.S. Utility patentapplication entitled “INTEGRATED CEILING DEVICE WITH MECHANICALARRANGEMENT FOR A LIGHT SOURCE,” Ser. No. 14/151,245, filed Jan. 9,2014, which claims priority to U.S. Provisional Patent Applicationentitled “DEVICE INTEGRATED AUTOMATED LUMINAIRE AND METHOD OFOPERATION,” Ser. No. 61/751,660, filed Jan. 11, 2013, the disclosures ofwhich are hereby incorporated entirely herein by reference.

TECHNICAL FIELD OF THE INVENTION

The present invention relates generally to integrated ceiling devicetechnology including lighting. More specifically, the present inventionrelates to an integrated ceiling device including a mechanicalarrangement for a light emitting diode (LED) light source havingeffective heat dissipation capability and efficient optics.

BACKGROUND OF THE INVENTION

Historically, the building industry has employed a large number ofprofessions to design, manufacture, and maintain building systems thatperform a variety of functions. These various functions include, forexample, lighting control, smoke detection, air quality monitoring,occupancy awareness, and so forth. Each individual system carries withit costs associated with upfront equipment purchase, installation,operation, and maintenance. While cost control is important, additionalfactors such as aesthetic appeal, ease of use and maintenance,expandability, and so forth can be equivalently critical in the design,manufacture, operation, and maintenance of a variety building systems.

Increasingly, industry is focusing on intelligent systems or smartsystems to provide a variety of building system functions.Unfortunately, these intelligent systems can be costly, complex, anddifficult to maintain. Moreover, due at least in part to historicallegacy, few advances have been made in offering building ownersefficient, economical, and aesthetically pleasing smart buildingsolutions.

SUMMARY

According to an aspect of this disclosure, an integrated device includesa mechanical arrangement that further includes an electronics housingconfigured to retain an electronic assembly and a heat sink, wherein theelectronics housing extends above the heat sink and is substantiallyvertically aligned with a vertical axis of the heat sink. Additionally,in accordance with this aspect, the electronics housing is coupled tothe heat sink to form an air gap extending between the electronicshousing and the heat sink, and at least one light source is coupled tothe heat sink. Further, according to this aspect, heat generated by theheat sink, at least one light source, and at least one electronic deviceretained by the electronics housing induces at least a portion of air toflow above the heat sink and through the air gap extending between theelectronics housing and the heat sink.

According to another aspect of this disclosure, an integrated deviceincludes a mechanical arrangement that further includes a housingconfigured to retain an electronic assembly, and a heat sink coupledwith a first light source such that the first light source illuminates afloor disposed below the integrated device. This aspect also includes anelectronics housing coupled to the heat sink from above the heat sinksuch that the electronics housing is disposed proximal a vertical axisof the heat sink, and a second light source disposed above the firstlight source such that the second light source illuminates a ceilingdisposed above the integrated device.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete understanding of the present invention may be derived byreferring to the detailed description and claims when considered inconnection with the Figures, wherein like reference numbers refer tosimilar items throughout the Figures, the Figures are not necessarilydrawn to scale, and:

FIG. 1 shows a top perspective view of a mechanical arrangement for anintegrated ceiling device, i.e., a LEAM, in accordance with anembodiment;

FIG. 2 shows a bottom perspective view of the mechanical arrangement ofFIG. 1;

FIG. 3 shows a top view of the mechanical arrangement;

FIG. 4 shows a bottom view of the mechanical arrangement;

FIG. 5 shows a side view of the mechanical arrangement;

FIG. 6 shows a side sectional view of the mechanical arrangement;

FIG. 7 shows a top perspective view of an integrated ceiling device,i.e., a LEAM, in accordance with another embodiment;

FIG. 8 shows a bottom perspective view of the LEAM of FIG. 7;

FIG. 9 shows a top view of the LEAM of FIG. 7;

FIG. 10 shows a bottom view of the LEAM of FIG. 7;

FIG. 11 shows a side view of the LEAM of FIG. 7;

FIG. 12 shows a side sectional view of the LEAM of FIG. 7;

FIG. 13 shows a top perspective view of an integrated ceiling device,i.e., a LEAM, in accordance with another embodiment;

FIG. 14 shows a bottom perspective view of the LEAM of FIG. 13;

FIG. 15 shows a top view of the LEAM of FIG. 13;

FIG. 16 shows a bottom view of the LEAM of FIG. 13;

FIG. 17 shows a side view of the LEAM of FIG. 13;

FIG. 18 shows a side sectional view of the LEAM of FIG. 13;

FIG. 19 shows a bottom perspective view of a device that may be mountedto the mechanical arrangement of FIG. 1 in accordance with anotherembodiment;

FIG. 20 shows a top perspective view of the device of FIG. 19;

FIG. 21 shows a side view of the device of FIG. 19;

FIG. 22 shows a bottom view of the device of FIG. 19;

FIG. 23 shows a top view of the device of FIG. 19;

FIG. 24 shows a bottom perspective view of a device that may be mountedto the mechanical arrangement of FIG. 1 in accordance with anotherembodiment;

FIG. 25 shows a top perspective view of the device of FIG. 24;

FIG. 26 shows a side view of the device of FIG. 24;

FIG. 27 shows a bottom view of the device of FIG. 24;

FIG. 28 shows a top view of the device of FIG. 24;

FIG. 29 shows a side view of the light fixture of FIG. 13 with thedevices of FIGS. 19 and 24 retained on the light fixture; and

FIG. 30 shows a block diagram of an electronics assembly including avariety of devices that may be included within the electronics assembly56 for any of the LEAMs.

DETAILED DESCRIPTION

Suitable ambient lighting is a quintessential need in virtually everybuilding system application, and the lighting industry is rapidlymigrating from traditional light sources such as fluorescent, highintensity discharge (HID), and incandescent lamps to solid statelighting, such as light-emitting diodes (LEDs). Light fixtures(technically referred to as luminaires in accordance with InternationalElectrotechnical Commission terminology) employing LEDs initiallyappeared in small devices utilized in low light output applications.Increasingly, light fixtures employing LEDs can be found in indoorcommercial applications, such as predominantly high-end offices,institutional spaces, and supermarkets' refrigerated spaces. In exteriorapplications, municipalities and some large box retailers have begunreplacing their traditional street and pole mounted light fixtures withfixtures employing LEDs. LED technology is also being embraced by theautomotive and aircraft industries.

An LED lamp is a solid state device. The solid state technology canenable device integration in an un-paralleled manner thus leading toopportunities in the areas of efficient energy usage, efficient use ofhuman resources, safer and more pleasant illumination, and better use ofmaterial resources. Indeed, light fixtures employing LEDs are fastemerging as a superior alternative to conventional light fixturesbecause of their low energy consumption, long operating life, opticalefficiency, durability, lower operating costs, and so forth.

There are presently a number of technical and economic problemsassociated with the implementation of high-output LED light fixtures inthe market. The LED lamp cost is high when compared with traditionallight sources. Smaller LED lamps yield higher efficiency. However, togenerate high light output with LED lamps, clusters of LED lamps need tobe formed. The more LED lamps used, the higher the cost. Additionally,cool operation is essential to the electronics devices and particularlyto the LED lamp.

A cluster of high output LED lamps in close proximity to one anothergenerates a significant amount of heat. Thus, implementation of LEDs formany light fixture applications has been hindered by the amount of heatbuild-up. High temperature reduces the lamp efficiency and may shortenthe life of the lamp and other electronic components, eventually causingdevice failure. Additionally, the life of the LED lamp and its outputdepends on the surrounding ambient temperature, and most critically, itsimpact on the lamps' junction temperature. The junction temperature isthe temperature where the lamp die is secured to the factures' heatsink. As the heat generated with high output LED lamps increases, sodoes the difficulty of designing large passive heat sinks that arearchitecturally attractive, lightweight, and economically feasible.Consequently, effective heat dissipation is an important designconsideration for maintaining light output and/or increasing lifespan ofthe LED light source.

Embodiments of the invention entail an integrated ceiling device and amechanical arrangement for that provides effective heat dissipation fora number of light sources installed in the integrated ceiling device.For brevity, the integrated ceiling device will be referred to herein asa Local Environmental Area Manager (LEAM). The LEAM, with the mechanicalarrangement, is configured to accommodate multiple LED light sources.The mechanical arrangement maintains low junction temperature byeffectively conducting heat generated by the LED light sources, alsoreferred to herein as LED lamps, away from other LED lamps and otherelectronic components. Maintaining a low temperature at this junctionyields improvements in lamp energy efficiency and enhanced lifespan forthe LED light sources.

Additionally, the configuration of the mechanical arrangement physicallyisolates the heat dissipating structure of the mechanical arrangementfrom a housing in which an electronics assembly for the LEAM is housed.As such, the housing may be sized to accommodate a plurality of onboardelectronic devices (e.g., camera, occupancy sensor, air quality sensor,smoke detector, and so forth) that are not unduly taxed by the heatproduced by the LED light sources. These onboard electronic devices maybe configured to emulate human sensory capability and to make actionabledecisions based on changing environmental conditions in which the LEAMis located. As such, the LEAM can be a configured as a smart system toprovide a variety of building system functions. Accordingly, the LEAMincludes key elements that are organized in a manner that resolves themechanical, thermal, electrical, and architectural challenges that arecommonly associated with the design of high-output LED light fixturesand other ceiling mounted devices. Further the structural configurationof the LEAM makes the LEAM suitable for use in a wide variety ofenvironments, such as, commercial, institutional, and industrialapplications.

Referring now to FIGS. 1-6, FIG. 1 shows a top perspective view of amechanical arrangement 20 for an integrated ceiling device, i.e., aLEAM, in accordance with an embodiment. FIG. 2 shows a bottomperspective view of mechanical arrangement 20. FIG. 3 shows a top viewof mechanical arrangement, FIG. 4 shows a bottom view of mechanicalarrangement 20, FIG. 5 shows a side view of mechanical arrangement, andFIG. 6 shows a side sectional view of mechanical arrangement 20. Theinclusion of mechanical arrangement 20 into various LEAM embodimentswill be discussed below in connection with FIGS. 7-18.

Mechanical arrangement 20 generally includes a housing 22, a heatdissipating structure 24, and support arms 26. Housing 22, heatdissipating structure 24, and support arms 26 may be monolithicallycasted or printed, or can be assembled by joining casted and non-castedelements. Heat dissipating structure 24, as well as housing 22 andsupport arms 26 may be manufactured from a heat dissipating,non-corrosive material and may be painted or otherwise treated to suitarchitectural needs. The configuration of mechanical arrangementprovides a rigid design suitable in adverse environments, and housing22, heat dissipating structure 24, and support arms 26 are organized ina manner that maximizes air flow across the elements.

With particular reference to FIGS. 3 and 5, housing 22 exhibits agenerally cylindrical shape having an outer diameter 28 and a height 30along a longitudinal axis 32 of mechanical arrangement 20 (see FIG. 5).In alternative architectural configurations, housing 22 need not becylindrical in shape, but may instead be any other suitablethree-dimensional shape. Additionally, housing 22 may be expanded bothvertically and horizontally to accommodate device scalability.

Heat dissipating structure 24 includes a central opening 34 surroundedby a plurality of fins 36 having a height 38 (see FIG. 5). Thus, heatdissipating structure 24 is generally ring-shaped, with central opening34 exhibiting an inner dimension, and more particularly, an innerdiameter 40 (best seen in FIGS. 3-4). In the illustrated embodiment,heat dissipating structure 24 is a circular ring-shaped structurecorresponding with the shape of housing 22. However, in alternativearchitectural configurations, heat dissipating structure 24 may have adifferent surrounding shape, e.g., rectangular, oblong, triangular, andso forth, while still retaining central opening 34. It should be furtherunderstood that in alternative architectural configurations, centralopening 34 need not be circular, but could instead have another shapecorresponding to, or differing from, the shape of housing 22 and/or heatdissipating structure 24.

Housing 22 is positioned within central opening 34, and support arms 26extend between and interconnect housing 22 with heat dissipatingstructure 24. Outer diameter 28 of housing 22 is less than innerdiameter 40 of central opening 34. Therefore, housing 22 is physicallyspaced apart from fins 36 by an air gap 42 extending between housing 22and heat dissipating structure 24. The configuration of fins 36 permitsfree air flow of no less than two hundred and seventy degrees across itsvertical axis and the configuration of housing 22 permits no less thanthree hundred and twenty degrees of free air flow across its verticalaxis and in between support arms 26. In addition, housing 22 and heatdissipating structure 24 are exposed to air at their tops and bottomfaces. Thus, air is free to flow between housing 22 and heat dissipatingstructure 24 and over housing 22 and heat dissipating structure 24 toprovide effective cooling. Furthermore, housing 22 and its contents areprotected from moving objects in the surrounding area by fins 36 of heatdissipating structure 24.

Outer vertical walls 45 at each quarter section of heat dissipatingstructure 24 can include bores 47, i.e., a hole or passageway, which canserve as an attachment point for a decorative cover, protective frame,protective reflector frame, and the like (not shown). Additionally, theplurality of fins 36 are spaced about the circumference of heatdissipating structure 24. In particular, fins 36 are generally uniformlydistributed about both an outer perimeter 44 and an inner perimeter 46of heat dissipating structure 24. Thus, fins 36 extend partially intoair gap 42 between housing 22 and heat dissipating structure 24. Themultitude of fins 36 maximize airflow about heat dissipating structure24 and thereby facilitate effective heat dissipation.

Heat dissipating structure 24 further includes a generally ring-shapedbottom face 48 (FIGS. 2, 4, and 5) connected with fins 36 and at leastone lamp seat 50 formed in bottom face 48. Heat dissipating structure 24and bottom face 48 may be formed as two separately manufacturedcomponents that are bolted, welded, or otherwise coupled together duringmanufacturing. In the illustrated an embodiment, a plurality of lampseats 50 are formed in bottom face 48 of heat dissipating structure 24,and are generally uniformly distributed in bottom face 48.

Bottom face 48 further includes recessed channels 52 (FIGS. 2, 4, 5)formed therein. Recessed channels 52 are suitably formed and routed toprovide the locations in bottom face 48 for electrically interconnectingeach of lamp seats 50. That is, wiring (not shown) may be directedthrough recessed channels 52 when mechanical arrangement 20 is assembledwith other components (discussed below) to form a particular LEAM withlighting capacity. Recessed channels 52 are illustrated in FIGS. 2, 4, 5for exemplary purposes. In actual practice, recessed channels 52 wouldnot be visible on an exterior surface of bottom face 48 of heatdissipating structure 24.

Each lamp seat 50, in the form of, for example, a direct mounted die, isconfigured to receive a light source 54 (see FIG. 8). Light source 54may be any suitable lamp or light array, such as an LED lamp. Each lampseat 50 extends inwardly into heat dissipating structure 24 so that eachlamp seat 50 is generally surrounded by fins 36. The configuration ofheat dissipating structure 24 with fins 36 effectively conducts heatgenerated by the LED light sources 54 away from LED light sources 54.Maintaining a low temperature at lamp seats 50 yields improvements inlamp energy efficiency and enhanced lifespan for the LED light sources54.

In its centralized location in central opening 34 of heat dissipatingstructure 24, housing 22 functions to centralize power distribution andserves as a data receiving and transmitting hub for a LEAM that includesmechanical arrangement 20. More particularly, an electronics assembly56, generally represented by dashed lines in FIG. 6, is retained inhousing 22, and electronics assembly 56 is configured for electricallyinterconnecting light sources 54 (FIG. 7) to an external power source(not shown). Housing 22 can additionally contain sensory andcommunications devices, as will be discussed below in connection withFIG. 30. Housing 22 may include one, two, or more distinct compartmentsthat may be defined by voltage classification. For example, alternatingcurrent (AC) line voltage devices may be placed at the top portion ofhousing 22, while lower AC or direct current (DC) voltage devices mayreside at the bottom portion of housing 22. Power may enter housing 22from above and may then be distributed to the various devices withinelectronics assembly 56.

In some embodiments, an outer surface 58 of housing 22 includes aplurality of fins 60 extending into air gap 42 (FIG. 3) between housing22 and heat dissipating structure 24. Fins 60 effectively increase asurface are of outer surface 58 of housing 22 to facilitate rapidcooling of the housed electronics assembly 56 to yield enhanced lifespanfor the components of electronics assembly 56. Accordingly, theconfiguration of mechanical arrangement 20 enables cool device operationby the physical separation of electronics assembly 56 in housing 22 andlight sources 54 within heat dissipating structure 24, and the free flowof air around both housing 22 and heat dissipating structure 24.Furthermore, housing 22 containing electronics assembly 56 is protectedfrom moving objects in the immediate area by the surrounding heatdissipating structure 24.

Support arms 26 provide structural support for heat dissipatingstructure 24 while structurally isolating structure 24 from housing 22.In some embodiments, support arms 26 may have a generally V- or U-shapedcross sectional configuration, having a top removable cover 62 (seeFIGS. 1 and 3), where removable cover 62 is wider than a base 63 (seeFIG. 2) of each of support arms 26. The shape of support arms 26 inducesfree air flow upwardly around support arms 26, again to provideeffective cooling. As generally shown in FIG. 3, at least one of supportarms 26 includes an interior passage 64 (revealed when cover 62 isremoved) for directing wiring 66 from electronics assembly 56 (FIG. 6)retained in housing 22 to each of lamp seats 50.

Support arms 26 may additionally provide structural support for otherdevices (discussed in connection with FIGS. 19-28). By way of example,an exterior surface 68 of cover 62 may additionally include a plug-inreceptacle 70 and mounting holes 72 formed therein. A portion of wiring66 may be routed to plug-in receptacle 70. Thus, external devices (notshown) may be removably mounted on exterior surface 68 of at least oneof support arms 26. Such an external device can include a plug element74 (see FIG. 19) that is attachable to plug-in receptacle 70 so that theexternal device has communication and power connectivity to electronicsassembly 56 (FIG. 6).

Accordingly, mechanical arrangement 20 provides mechanical scalability.This scalability permits flexibility in choice of light output, aparticular reflector assembly, and device choice and quantity, withouthaving to re-design the form of mechanical arrangement 20. That is,housing 22, heat dissipating structure 24, and support arms 26 ofmechanical arrangement 20 enable mechanical scaling thereby allowing forthe same base architecture to be used in a variety of applications.These applications may include higher light output, different opticalrequirements, and device mix requirements.

Referring now to FIGS. 7-12, FIG. 7 shows a top perspective view of anintegrated ceiling device, referred to as a Local Environmental AreaManager (LEAM), 80 in accordance with another embodiment. FIG. 8 shows abottom perspective view of LEAM 80. FIG. 9 shows a top view of LEAM 80.FIG. 10 shows a bottom view of LEAM 80. FIG. 11 shows a side view ofLEAM 80, and FIG. 12 shows a side sectional view of LEAM 80. In general,LEAM 80 includes mechanical arrangement 20, electronics assembly 56(generally represented in FIG. 12) retained in housing 22 of mechanicalarrangement 20, and a refractor assembly 82 retained on heat dissipatingstructure 24 via a frame 84. In this example, frame 84 is secured toheat dissipating structure 24 via screws 86 attached to bores 47(FIG. 1) in vertical walls 45 (FIG. 1) of heat dissipating structure 24.LEAM 80 may be adapted for use in a commercial environment where diffuselighting, low glare, and an aesthetically pleasing appearance may berequired. As such, along with refractor assembly 82, a reflectorassembly 85 may be supported by support arms 26 and heat dissipatingstructure 24 in order to diffuse the light and/or to reduce glare fromlight sources 54.

As particularly shown in FIGS. 7, 9, 11, and 12, LEAM 80 includes amounting cap 88 that couples to a top end 89 of housing 22 via fasteners90. Mounting cap 88 may employ a conventional power hook hanger 92.Power hook hanger 92 provides a fastening means for coupling LEAM 80 toan exterior location, such as the ceiling of a building. Additionally,power hook hanger 92 is configured to enable the passage of wiring 93(see FIG. 30) so that LEAM 80 can be powered via building power.

Mounting cap 88 may additionally include provisions for data lineconnectivity via a data line receptacle 94 installed in mounting cap 88and operatively connected to electronics assembly 56. Data linereceptacle 94 may be any receptacle suitable for data transfer such as,for example, an RJ45 receptacle, Universal Serial Bus (USB) receptacle,and the like. Data line receptacle 94 may be configured for attachmentof a data line 96 (see FIG. 12) between electronics assembly 56 and aremote device (not shown) to enable a transfer of data to and/or fromelectronics assembly 56. Additionally, or alternatively, an antenna 98may be installed in mounting cap 88. Antenna 98 may be operativelyconnected to electronics assembly 56. Antenna 98 may be configured forreceiving and/or transmitting data between electronics assembly 56 and aremote device (not shown). Accordingly, implementation of data linereceptacle 94 and/or antenna 98 enables communication between a remotelylocated control station or monitoring processor (not shown) andelectronics assembly 56.

As particularly shown in FIGS. 8, 10, and 12, LEAM 80 further includes aremovable access door 100 that couples to a bottom end 102 of housing22. Access door 100 can enable servicing of the devices that formelectronic assembly 56 retained within housing 22 of heat dissipatingstructure 24. Access door 100 may also incorporate one or more devices.For example, a speaker/microphone 104 and/or a smoke detector/airquality sensor 106 may be installed in access door 100. Additionally, oralternatively, a camera/occupancy sensor 108 may be installed in accessdoor 100. Some embodiments may include multiple controllable devicesthat make up electronic assembly 56. Accordingly, a series of switches110 and/or indicator lights 112 may be installed in access door 100 inorder to activate/deactivate and/or monitor the operation of the devicesthat make up electronic assembly 56. Again, the key electroniccomponents of light fixture 80 will be discussed in connection with FIG.30.

Now with particular reference to FIG. 12, refractor assembly 82 islocated at outer perimeter 44 of heat dissipating structure 24.Reflector assembly 85 is located at inner perimeter 46 of heatdissipating structure 24, and light sources 54 are positioned betweenrefractor and reflector assemblies 82 and 85, respectively. Refractorassembly 82 exhibits a first height 113 extending downwardly from alocation 114, i.e., the horizontal plane, of light sources 54, andreflector assembly 85 exhibits a second height 115 extending downwardlyfrom location 114 of light source 54. In an embodiment, first height 113is greater than second height 115. More particularly, first height 113of refractor assembly 82 may be at least one and one quarter timesgreater than second height 115 of reflector assembly 85.

Together, refractor assembly 82 and reflector assembly 85 form anoptical assembly 116 which is supported by, i.e., secured onto, heatdissipating structure 24. Accordingly, refractor assembly 82 may beformed from a translucent glass, or some other translucent material.Furthermore, refractor assembly 82 may employ prismatic optics. Incontrast, reflector assembly 82 may be formed from a highly reflectiveplastic, a material having a reflective material sputtered or otherwisedeposited on it, or a polished metal. Additionally, reflector assembly85 may employ segmented optics. In an embodiment, reflector assembly 85exhibits a profile, and in this configuration, an outwardly convexprofile that is configured to redirect light emitted from light source54 toward refractor assembly 85, as well as to downwardly direct lightemitted from light source 54.

Optical assembly 116, including refractor assembly 82 and reflectorassembly 85, functions to effectively redirect light from light sources54 in order to improve light source uniformity, to increase a “gloweffect,” and to reduce glare. Such a structure may obtain opticalefficiencies of greater than ninety-five percent. Additionally, thedifference between heights 113 and 115 largely prevents directvisibility of light sources 54 over sixty degrees from nadir, where thenadir (in accordance with the Illuminating Engineering Society of NorthAmerica) is defined as the angle that points directly downward, or zerodegrees, from a luminaire. Accordingly, FIG. 12 shows a nadir ascorresponding to a longitudinal axis 118 of LEAM 80. As further shown inFIG. 12, an approximately sixty degree angle is formed betweenlongitudinal axis 117, i.e., the nadir, and a virtual line intersectingthe bottommost edges of refractor assembly 82 and reflector assembly 85.It is known that light emitted in the eighty degree to ninety degreezone from nadir is more likely to contribute to glare. Accordingly, thedifference between heights 113 and 115 effectively limits the potentialfor glare by directing the light within the sixty degree from nadirrange.

Referring to FIGS. 13-18, FIG. 13 shows a top perspective view of anintegrated ceiling device, referred to as a Local Environmental AreaManager (LEAM), 120 in accordance with another embodiment. FIG. 14 showsa bottom perspective view of LEAM 120. FIG. 15 shows a top view of LEAM120. FIG. 16 shows a bottom view of LEAM 120. FIG. 17 shows a side viewof LEAM 120, and FIG. 18 shows a side sectional view of LEAM 120. Ingeneral, LEAM 120 includes mechanical arrangement 20, electronicsassembly 56 (generally represented in FIG. 18) retained in housing 22 ofmechanical arrangement 20, and frame 84 secured to heat dissipatingstructure 24, as described above.

LEAM 120 may not include refractor assembly 82 and reflector assembly85, as discussed in connection with LEAM 80 of FIG. 7. Rather, onlyframe 84 may be present to provide some amount of protection for lightsources 54 within LEAM 120 from movable objects in the location at whichLEAM 120 resides. LEAM 120 may be adapted for use in an industrialenvironment where high brightness and a relatively narrow beam patternmay be called for. In some configurations, LEAM 120 may include anoptical assembly, supported by heat dissipating structure 24, in theform of a plurality of individual reflector assemblies 122. As such,each light source 54 is surrounded by an individual one of reflectorassemblies 122. Reflector assemblies 122 may be supported or retained bybottom face 48 of heat dissipating structure 24 and support arms 26 inorder to focus the light pattern from light sources 54. In someembodiments, individual reflector assemblies 122 may have differentoptical properties. Additionally, light sources 54 may have varyinglight output. Thus, a combination of reflector assemblies 122 and lightsources 54 can be selected to provide a desired lighting pattern.

Like LEAM 80 (FIG. 7), LEAM 120 includes mounting cap 88 having powerhook hanger 92, data line receptacle 94, and/or antenna 98 installedtherein. Additionally, LEAM 120 includes access door 100 havingspeaker/microphone 104, smoke detector/air quality sensor 106,camera/occupancy sensor 108, switches 110 and/or indicator lights 112incorporated therein as discussed above. Again, the key electroniccomponents of light fixture 120 will be discussed in connection withFIG. 30.

Referring to FIGS. 19-23, FIG. 19 shows a bottom perspective view of adevice 130 that may be mounted to mechanical arrangement 20 (FIG. 1) inaccordance with another embodiment. FIG. 20 shows a top perspective viewof device 130. FIG. 21 shows a side view of device 130. FIG. 22 shows abottom view of device 130, and FIG. 23 shows a top view of device 130.In an embodiment, device 130 may be an uninterruptable power supply(UPS) that can provide emergency power when the input power source, inthis case mains power, fails. Accordingly, device 130 will be referredto hereinafter as UPS 130.

UPS 130 includes a housing 132 and the necessary electronics (not shown)retained in housing 132 for supplying emergency power when incomingvoltage falls below a predetermined level. The electronics may include,for example, a charger, backup battery, and DC-AC input inverter (notshown) as known to those skilled in the art. As shown in FIGS. 22 and23, housing 132 has a profile that is adapted to interface with outersurface 58 (FIG. 1) of housing 22 (FIG. 1) of mechanical arrangement 20(FIG. 1). A bottom surface 134 of housing 132 includes plug element 74that is attachable to plug-in receptacle 70 (FIG. 3) formed in cover 62(FIG. 3) of one of support arms 26 (FIG. 3) so that UPS 130 iselectrically connected to electronics assembly 56 (FIG. 6), as discussedpreviously. Additionally, bottom surface 134 may include mounting holes136 that mate with mounting holes 72 (FIG. 3) in cover 62. Conventionalfasteners (not shown) may be utilized to fasten housing 132 to cover 62via mounting holes 136 and mounting holes 72.

Referring to FIGS. 24-28, FIG. 24 shows a bottom perspective view of adevice 140 that may be mounted to mechanical arrangement 20 (FIG. 1) inaccordance with another embodiment. FIG. 25 shows a top perspective viewof device 140. FIG. 26 shows a side view of device 140. FIG. 27 shows abottom view of device 140, and FIG. 28 shows a top view of device 140.In an embodiment, device 140 may be an uplight that is positioned tocast its light in a direction opposite, for example, upwards, from thelight cast by light sources 54 (FIG. 8). As such, device 140 is referredto hereinafter as uplight 140. Uplight 140 may be activated alone oralong with light sources 54 during normal operation when it is desirableto cast light upwards to provide all-round indirect illumination.Alternatively, or additionally, uplight 140 may be activated during anextended loss of mains power in order to provide emergency lighting.

Uplight 140 includes a housing 142 having a light source 144 installedin a top surface 146 of housing 142. Electronics (not shown) may beretained in housing 142 for operating light source 144, as known tothose skilled in the art. In some configurations, light source 144 maybe an LED or any other suitable light source. Accordingly, housing 142may include a heat sink region 148 formed in one or more side walls 150of housing 142. Heat sink region 148 may include multiple fins that areconfigured to conduct the heat generated by light source 144 away fromlight source 144.

As shown in FIGS. 27 and 28, housing 142 has a profile that is adaptedto interface with outer surface 58 (FIG. 1) of housing 22 (FIG. 1) ofmechanical arrangement 20 (FIG. 1). A bottom surface 152 of housing 142includes another plug element 74 that is attachable to plug-inreceptacle 70 (FIG. 3) formed in cover 62 (FIG. 3) of one of supportarms 26 (FIG. 3) so that uplight 140 can be electrically connected toelectronics assembly 56 (FIG. 6), as discussed previously. Additionally,bottom surface 152 may include mounting holes 154 that mate withmounting holes 72 (FIG. 3) in cover 62. Conventional fasteners (notshown) may be utilized to fasten housing 142 to cover 62 via mountingholes 152 and mounting holes 72.

FIG. 29 shows a side view of light fixture 80 of FIG. 13 with UPS 130and uplight 140 retained on light fixture 80. As discussed above, eachof UPS 130 and uplight 140 are removably mounted to an exterior surfaceof one of support arms 26 (FIG. 3). More particularly, each of UPS 130and uplight 140 is mounted to top removable cover 62 (FIG. 3) of one ofsupport arms 26 and abuts housing 22 of mechanical arrangement 20.Additionally, plug element 74 (FIGS. 19 and 24) of its respective UPS130 and uplight 140 is attached with its respective plug-in receptacle70 (FIG. 3) installed in top cover 62 so as to electrically connect UPS130 and uplight 140 to electronics assembly 56 (FIG. 6) retained inhousing 22.

FIG. 30 shows a block diagram of electronics assembly 56 including avariety of devices that may be included within electronics assembly 56of any of LEAM 80 (FIG. 7), LEAM 120 (FIG. 13), or any of a number ofLEAM designs. In general, electronics assembly 56 includes sufficientprocessing power coupled with sensor perception in order to emulate thehuman capacity of make actionable, predictable, and accurate decisionsin response to environmental changes. To that end, electronics assembly56 is capable of accepting and operating a variety of devicesindependently or in unison. These devices may be miniaturized to providea broader platform for a larger number of devices with greaterinteractive capabilities. Thus, electronics assembly 56 may beconsidered a Local Environment Area Manager (LEAM) where the lightingrelated components provide the physical platform for the LEAM. Forpurposes of explanation, electronics assembly 56 will be described inconnection with LEAM 80. As such reference should be made to FIGS. 7-12concurrent with the following description.

Key components of electronics assembly 56 include one or more powersupplies 160, a communicator element 162, one or more processors 164,and an array of devices 166 capable of data/signal input and output,each of which may be suitably connected via a power bus 168 (representedby solid lines) and a data bus 170 (represented by dotted lines).

In general, power supply 160 receives line power 172 via wiring 93routed through power hook hanger 92 and converts line power 172 to thepower needed to operate the various devices of electronics assembly 56.Power supply 160 may be modular and scalable having one or more inputpower channels 174 and output power channels 176. Input and output powerchannels 174, 176 may be programmable with flexibility to change thepower supplied and device specific power operational parameters asneeded. Power supply 160 may have an optional dedicated processor 178,represented in dashed line form, governing the power from power supply160 while maintaining real time communication with processor 164 ofelectronics assembly 56. In some embodiments, power supply 160 may alsohave direct communication capability with an external network (notshown).

Data output from power supply 160 may include reporting on the qualityof the input power, the operational temperature of power supply 160, thepower consumption of power supply 160 including client devices such ascommunicator element 162, processor 164, and array of devices 166, timeof usage broken down by device, and operational anomalies. Power supply160 processes the highest electrical load of electronics assembly 56.Therefore, power supply 160 may be located in the upper region or anupper compartment of housing 22. The upper region of housing 22 hasthree hundred and sixty horizontal degrees of exposure to cooling aircirculation and full exposure to cooling air at mounting cap 88 forproviding effective cooling to the housed power supply 160. The circuitboards (not shown) for power supply 160 may be wired by a conventionalmethod or engaged by plug-in connectors. Additionally, the circuitboards may be encased or open and may be secured directly to housing 22by mounting them along the inner perimeter of housing 22.

As a local environment area manager, electronics assembly 56 includescommunicator element 162 in order to permit direct or via processor 164communication with onboard array of devices 166. Additionally,communicator element 162 may be configured to enable communicationbetween a plurality of LEAMs 80, to enable communication with a local orremote building management system, and/or with local or remote clients.Such clients could be corporate offices or first responders needing realtime input about a specific location in a building. Communicator element162 may employ radio frequency (RF) communication via antenna 98, powerline communication (PLC) carrying data on the mains power line carryingline power 172, a dedicated data line such as data line 96 connectedwith data line receptacle 94, or any combination thereof.

In some embodiments, each LEAM 80 may be initialized with a uniqueaddress and an optional ability to assign a sub-address to all deviceswithin LEAM 80. In this manner, the operational integrity of the variouselements of electronics assembly 56 may be monitored and any anomalieswith onboard devices may be alerted, identifying the nature of theanomaly and possible recommendations for action.

Processor 164 can contain resident memory 180 that may be programmedwith control code 182 prior to delivery to a building, duringcommissioning, or at any time thereafter. Programming may be performedby a wired connection to a port, e.g., data line 96 connected to dataline receptacle 94 or wirelessly via antenna 98. System updates anddevice specific updates to control code 182 may occasionally beperformed with occasional device upgrades.

Processor 164, executing control code 182, may be configured to receivelocal device sensory input from one or more devices of array 166, andthen compile this information in accordance with pre-programmedinstructions. Processed information may then be converted to actionableoutput to array of devices 166. In addition, processor 164 maycommunicate with neighboring or remote devices and may transmitinstructions, instructions and data, or instructions, data and images.Processing power may vary among electronic assemblies 56 of a variety ofLEAMs, based on the application's specific needs.

Control code 182 may be multi-device relational software designed tooperate array of devices 166 in unison. Control code 182 may be scalableby modules, where each module relates to the functionality of anassociated device and its relation to other onboard devices and theentire network's devices. Control code 182 may be provided with inputtables such as schedules and set points, as well as alert parameters andoperational reports. In addition, control code 182 can be customized forspecific applications and may include self-learning modules. Processor164 has sufficient memory 180 associated therewith in order to accessand act on pertinent information in real time. Additionally, controlcode 182 may be provided with a self-reporting module associated witheach device in array 166 in order to report the device's operationalcondition and provide alerts when the device performs outside itsoptimal performance range.

Array of devices 166 includes light sources 54 and uplight 140, and mayinclude one or all of the following: camera 108; a compass 186;speaker/microphone 104 or a combination thereof; smoke detector/airquality sensor 106; an occupancy sensor 192; a thermostat 194; a backupbattery, e.g., UPS 130 (FIG. 19); and noise suppression circuitry 196.The devices presented in array 166 should not be considered to be allinclusive. That is, the devices represented in array 166 mayadditionally include other building system and monitoring devices andcircuits not listed herein.

The various devices within array 166 may be utilized in connection withcomfort control, life safety, loss prevention, marketing analysis, assetmanagement functions, and/or operational optimization. Comfort controlmay entail lighting uniformity, sound control including suppression,temperature control, air quality control, and so forth. Life safety mayentail air quality monitoring, local and remote alarming, lighting andsound delineation of egress pathway, live feed to first responders, theidentification of “hot spots” in event of fire or crime, and so forth.Loss prevention may entail system alarming for operational anomalies,theft prevention via behavioral software analysis, produce spoilageavoidance by monitoring local ambient air temperature, and so forth.Marketing analysis may entail monitoring or customer traffic pattern,customer behavior, customer gender, cash register wait time, customervolume, customer time of day week and month visit, customerdemographics, and so forth. Asset management may entail spaceutilization reporting, facility design performance analysis, assetinventory control, asset depreciation record, and so forth. Operationaloptimization may entail energy usage monitoring, reduction inmaintenance men hours via event and alarms reporting, event recordation,product and system performance evaluation, and so forth.

A key feature of LEAMs 80, 120 having mechanical arrangement 20 is theoptimization of exposure to the surrounding cooling air and airflow atleast two hundred and seventy degrees across the vertical axis of heatdissipating structure 24, as well as the vertical and horizontal axes ofhousing 22. The form of mechanical arrangement 20 is determined by itsthree key components, i.e., heat dissipating structure 24 at theperimeter of mechanical arrangement 20, housing 22 at the center ofmechanical arrangement 20, and support arms 26 bridging betweenstructure 24 and housing 22 through which power flows to light sources54 in heat dissipating structure 24. The form of mechanical arrangement20 is critical to superior thermal heat management of LEAMs 80, 120.

Another key feature of LEAMs 80, 120 having mechanical arrangement 20and electronics assembly 56 is the capability to mount lighting andnon-lighting related environment sensory devices (e.g.,speaker/microphone 104, smoke detector/air quality sensor 106, andcamera/occupancy sensor 108) in access door 100 at bottom end 102 ofhousing 22, as well as mounting communication devices (e.g., data linereceptacle 94 and antenna 98) in mounting cap 88 at top end 89 ofhousing 22. With the proximity of communication devices to the powerentry for LEAMs 80, 120 at power hook hanger 92, efficiencies areachieved due to centralized placement location for the lighting andnon-lighting related devices. Moreover, the separation between thehoused electronics assembly 56 and light sources 54 enables effectivecooling of the housed electronics assembly 56, as well as protectionfrom exterior forces.

Another key feature of LEAMs 80, 120 with centrally located housing 22is the capability to access power supply 160 at bottom end 102 ofhousing 22 via removably mounted access door 100. Certain components,such as power supply 160 may be readily and quickly inserted and removedthrough guiding slots on an inner perimeter of housing 22. Since accessdoor 100 is removable, all devices within housing 22 may be equippedwith a quick disconnect in order to install, remove, and replace any ofthe devices within housing 22.

Yet another key feature of LEAMs 80, 120 includes the capability toprovide backup emergency battery, e.g., UPS 130, whose power may beselectively distributed to all essential services and devices during anemergency, which can be received either from a light fixture driver or asecondary step-down power device. In some embodiments, UPS 130 may beconnected to the light fixture audio system, e.g., speaker/microphone104. Additionally, UPS 130 may be networked with other input/outputonboard environmental data collection, assessment, and operationaldevices, and have remote communication capability.

Another key feature of LEAMs 80, 120 includes an emergency light system,e.g., light sources 54, that may be used to delineate an egress path bysupplementing the ambient light level to identify the directionality ofthe path to egress doors. This down light feature, using light sources54 may be supplemental with a strobe light. In some embodiments,speaker/microphone 104 may be used to broadcast a pathway directionidentifier.

Another key feature of LEAMs 80, 120 is the capability to operate one orseveral onboard devices from array 166, such as backup battery 130,speaker/microphone 104, smoke detector/air quality sensor 106,camera/occupancy sensor 108, communicator element 162, and compass 186in unison, based on real time information processed and programmedinstructions.

A key feature of LEAMs 80, 120 having electronics assembly 56 entailsthe capability to perform auto-commissioning of a network of lightfixtures 80. For example, each of LEAMs 80, 120 includes a discreteaddress, camera 108, communicator element 162, processor 164 and/orremote processors. Processor 164 and/or the remote processors mayinclude an electronic map showing each of LEAMs 80, 120 by itsassociated discrete address and its relative location to the entirenetwork of LEAMs 80, 120. Auto-commissioning commences followingassociation of one LEAMs 80, 120 with its corresponding placement on theelectronic map.

Another key feature of LEAMs 80, 120 having electronics assembly 56entails light control at its local location. For example, each of LEAMs80, 120 includes a discrete address, camera 108 with an integrated lightmeter, compass 186, communicator element 162, processor 164 and/orremote processors. Processor 164 and/or the remote processors maymaintain a pre-determined light level by dimming or turning LEAMs 80,120 on or off through processing in real time local zone illuminationconditions data obtained by camera 108 and preprogrammed local or remotecontroller instructions.

Another key feature of LEAMs 80, 120 having electronics assembly 56entails the optimization of local and entire space environmentalconditions. Optimization methodology may utilize data from camera 108,occupancy sensor 192, as well as other onboard sensor devices such asprocessor 164, thermostat 194, communicator element 162, processor 164and/or remote processors to process data and act in real time onchanging conditions while operating within programmatic instructionguidelines.

Another key feature of LEAMs 80, 120 having electronics assembly 56entails the capability to collect environmental conditions data viacamera 108 and relay the data to local processor 164 and/or remoteprocessors. The data collected by camera 108 may include, but is notlimited to, the functionally of devices such as in occupancy sensing, alight meter output, a traffic count, human load density analysis, timeof day activity logging, and photographic and thermal imagery. Theprocessed data obtained by camera 108 with or without additionalinformation processed from other non-camera devices within LEAMs 80, 120facilitate optimal operation of LEAMs 80, 120.

Another key feature of LEAMs 80, 120 having electronics assembly 56entails the capability to function as a public announcement, sound, andalarming system through the provision of audio input/output viamicrophone/speaker 104. Additionally, microphone/speaker 104 may benetworked with other input/output onboard environment data collection,assessment, and operational devices, and have remote communicationcapability.

Another key feature of LEAMs 80, 120 having electronics assembly 56entails the implementation of smoke detector/air quality sensor 106.Smoke detector/air quality sensor 106 may also be networked with otherinput/output onboard environmental data collection, assessment, andoperational devices, and have remote communication capability.

In summary, embodiments described above resolve a number of themechanical, thermal, electrical, and architectural challenges that arecommonly associated with integrated ceiling system devices andparticularly with high-output LED light fixture design. Furthermore, thestructural configuration of the LEAM makes the LEAM suitable for use ina wide variety of environments, such as, commercial, institutional, andindustrial applications. Additionally, the LEAM including the mechanicalarrangement and electronics assembly may assume partial or full controlover the ambient environment in the vicinity of the LEAM, integratingoperational logic traditionally associated with isolated disciplines'networks of heating, ventilation, and air conditioning (HVAC) monitoringdevices, fire protection devices, air quality monitoring devices,input/output audio devices, temperature and humidity devices, securityand normal operation monitoring cameras, occupancy sensors, lightingcontrols, and so forth. Consequently, the LEAM including the mechanicalarrangement and the electronics assembly yields significant improvementsin terms of the integration of a variety of building system functionscombined with the quintessential need for suitable ambient lighting inan aesthetically pleasing form factor.

While the principles of the inventive subject matter have been describedabove in connection with specific apparatus configurations describedabove, it is to be clearly understood that this description is made onlyby way of example and not as a limitation on the scope of the inventivesubject matter. For example, embodiments may be implemented in systemshaving other architectures as well. The various functions or processingblocks discussed herein and illustrated in the Figures may beimplemented in hardware, firmware, software or any combination thereof.Further, the phraseology or terminology employed herein is for thepurpose of description and not of limitation.

The foregoing description of specific embodiments reveals the generalnature of the inventive subject matter sufficiently so that others can,by applying current knowledge, readily modify and/or adapt it forvarious applications without departing from the general concept.Therefore, such adaptations and modifications are within the meaning andrange of equivalents of the disclosed embodiments. The inventive subjectmatter embraces all such alternatives, modifications, equivalents, andvariations as fall within the spirit and broad scope of the appendedclaims.

1. An integrated device comprising: a mechanical arrangement including: an electronics housing configured to retain an electronic assembly: a heat sink, wherein the electronics housing extends above the heat sink and is substantially vertically aligned with a vertical axis of the heat sink, wherein the electronics housing is coupled to the heat sink to form an air gap extending between the electronics housing and the heat sink, and wherein at least one light source is coupled to the heat sink, and wherein heat generated by the heat sink, at least one light source, and at least one electronic device retained by the electronics housing induces at least a portion of air to flow above the heat sink and through the air gap extending between the electronics housing and the heat sink.
 2. The device of claim 1, comprising a plurality of heat dissipating fins monolithically coupled to the heat sink.
 3. The device of claim 2, wherein a natural light emittance of the at least one light source coupled to the heat sink is optically altered by a lens.
 4. The device of claim 1, wherein an outer surface of the electronics housing comprises a plurality of heat dissipating fins.
 5. The device of claim 1, comprising an optical assembly coupled to the heat sink.
 6. The device of claim 5, comprising an optical assembly coupled to the at least one light source retained by the heat sink comprises at least one of a refractor and a reflector.
 7. The device of claim 1, wherein the device is disposed within a space to be illuminated, and wherein the at least one light source illuminates first and second surfaces disposed opposite one another.
 8. The device of claim 1, further comprising a removable access cover coupled to the electronics housing.
 9. The device of claim 8, wherein the at least one electronic device is coupled to the removable access cover of the electronic housing.
 10. The device of claim 1, wherein at least one sensing device is coupled to said integrated device.
 11. The device of claim 1, wherein a form of the heat sink is customizable.
 12. The device of claim 1, further comprising an electronic device externally mounted to at least one of the electronic housing and mechanical device coupling the electronic device housing to the heat sink.
 13. An integrated device comprising: a mechanical arrangement including: a housing configured to retain an electronic assembly; a heat sink coupled with a first light source, wherein the first light source illuminates a floor disposed below the integrated device; an electronics housing coupled to the heat sink from above the heat sink, wherein the electronics housing is disposed proximal a vertical axis of the heat sink, and a second light source disposed above the first light source, wherein the second light source illuminates a ceiling disposed above the integrated device.
 14. The device of claim 13, wherein the first light source and the second light source operate independently of one another.
 15. The device of claim 13, wherein the second light source is configured to minimize a shadow cast by the electronics housing on the ceiling.
 16. The device of claim 13, wherein at least one of the first light source and the second light source are controlled by at least one of a wireless and a wired remote controller.
 17. The device of claim 13, further comprising a plurality of heat dissipating fins monolithically coupled to the heat sink coupled to the first light source.
 18. The device of claim 17, wherein the second light source is disposed above a top horizontal surface of the heat sink.
 19. The device of claim 13, wherein a form of the heat sink is customizable.
 20. The device of claim 13, wherein an optical assembly coupled to the first light source comprises at least one of a refractor and a reflector.
 21. The device of claim 13, wherein at least one sensing device is coupled to said integrated device. 